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freepatentsonline.com: Metal fusion bonding


Method of manufacturing electronic part and electronic part obtained by the method
In a process for producing an electronic part which comprises soldering (A) an electronic member having conductor portions I for electric connection having a solder layer or a solder bump (a solder portion) on a surface of a tip and (B) an electronic member to be connected having conductor portions II for electric connection arranged at positions corresponding to positions of conductor portions I by pressing (A) to (B) under heating via an adhesive layer, the solder portion is brought into contact with the adhesive layer, the solder portion is melted by heating at a temperature of or higher than a melting point of the solder, the soldering is conducted by pressing the melted solder portion, and the adhesive layer is cured. An electronic part is obtained in accordance with the process. Electric connection is surely achieved and a highly reliable electronic part can be obtained with excellent productivity.

Solder printing process to reduce void formation in a microvia
In one embodiment, a method is provided. The method comprises filling a microvia formed in a bond pad with solder paste comprising solder balls of the first size; and coating the bond pad with solder paste comprising solder balls of the second size, wherein the second size is greater than the first size.

Solder bumps formation using solder paste with shape retaining attribute
Method of forming solder bumps of an integrated circuit package is described. A solder paste is formed from a material having a characteristic that the deposited instances thereof substantially retain their geometric shape upon exposure to electromagnetic radiation.

Method for refining and homogeneously distributing alloying partners and for removing undesirable reaction products and slags in or from soft solder during the production of fine solder powder
Method for refining and homogeneously distributing alloying partners and for removing undesired reaction products such as oxides and/or slag in or from soft solder during the production of fine solder powder, in which the solder alloy is melted in a high temperature-resistant plant and/or animal oil, the melt is moved to another container of oil with a temperature of at least 20° C. greater than the liquidus temperature, stirred there, and subjected to multiple shear treatments using rotors and stators for forming a dispersion comprising solder balls and oil, from which dispersion the solder balls are separated by means of subsequent sedimentation.

Manufacturing method for a ceramic to metal seal
A method of bonding a ceramic part to a metal part by heating a component assembly including the metal part, the ceramic part, and a thin essentially pure interlayer material placed between the two parts heated at a temperature that is greater than the temperature of the eutectic formed between the metal part and the interlayer material, but that is less than the melting point of the interlayer material, the ceramic part or the metal part is disclosed. The component assembly is held in intimate contact at temperature in a non-reactive atmosphere for a sufficient time to develop a hermetic and strong bond between the ceramic part and the metal part. The bonded assembly is optionally treated with acid to remove any residual free nickel and nickel salts to assure a biocompatible assembly for implantation in living tissue.

Manufacturing plant for parts, particularly vehicle body parts
A manufacturing plant ( 1 ) is provided for vehicle body parts ( 2, 3 ). The manufacturing plant includes a number of processing stations ( 4, 5, 6, 7, 8, 9, 10 ), which are situated one behind the other along a transfer line ( 22 ), and of a number of multiaxial robots ( 18, 19 ). In at least one processing station ( 4, 5, 6, 7, 8, 9, 10 ), one or more handling robots ( 18 ) for transporting parts is/are arranged on at least one axis of travel ( 20, 21 ). Next to the handling robot ( 18 ), one or more processing robots ( 19 ) is/are displaceably arranged on the same axis of travel ( 20 ). Working locations ( 11, 12 ) are arranged on both sides of a common axis of travel ( 20 ), whereby another common axis of travel can be provided on the rear side of the working locations.